Whoever said mobile gaming is a waste of time hasn’t tried business simulation games yet. You actually play through real-life ...

Abstract: Ultrasonic wire bonding is one of the critical challenges for power semiconductor manufacturing process, especially for silicon carbide (SiC) power devices. Packaging-related strain on the ...

Abstract: The Open Radio Access Network (O-RAN), manifested through the specifications established by the O-RAN Alliance, stands ready to transform the telecommunications ecosystem. In particular, the ...