Abstract: We introduce a new III-V-on-Silicon (Si) heterogeneous integration platform, where the III-V material is bonded to the back of a processed Si photonic wafer. This “Back-Side-on-Buried Oxide” ...

Abstract: Independent back bias in the ultrathin body and Box (UTBB) fully depleted silicon-on-insulator (FDSOI) serves as the critical knob for exploiting the performance and power tradeoffs and ...

Are you new to Linux and resisting the terminal? Or perhaps you're a longtime passionate user like me? Regardless, learning ...

Ahead of its 75th anniversary, Jack in the Box shared some big news. The fast-food chain has long been a late-night hot spot for fans to grab their favorite fried foods in a flash. But like many ...