From shoes to GPUs; super agents; TSMC, ASML results; new chiplets and test facilities; Stanford AI index; photonics deals; ...

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

The semiconductor industry is entering a critical transition phase toward Autonomous Semiconductor Fabs, driven by escalating ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional ...

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.