IBM has announced numerous advancements to its all-flash storage solutions, with the company's latest 3D three-level cell (TLC) FlashStorage technology promising increased storage density of previous ...

【环球网科技综合报道】3月12日消息，IBM 从美国专利商标局获得了一项 4D 打印专利，该技术可用于使用 4D 打印的智能材料运输微粒，为医疗、工业等领域带来了新的可能性。 据介绍，IBM 的这项专利技术基于 4D 打印，即在 3D 打印的基础上增加了时间维度。

ST. PAUL, Minn. and ARMONK, N.Y., Sept. 7, 2011 /PRNewswire/ -- 3M and IBM (NYSE: IBM) today announced that the two companies plan to jointly develop the first adhesives that can be used to package ...

IBM and 3M today said they will develop new adhesives designed to build silicon towers that will be packaged on 3D semiconductors. The collaboration--IBM brings the semiconductor know-how and 3M is ...

IBM scientists have created a 3D map of the earth so small that 1,000 of them could fit on one grain of salt. The scientists accomplished this through a new, breakthrough technique that uses a tiny, ...

is taking chips into the third dimension. The technology giant said Thursday that later this year it will begin producing semiconductors that use a 3D technology to stack multiple chips atop one ...

IBM Selects GeForce FX Go5200 for New Thinkpad Based on Razor Sharp Visuals and Outstanding Reliability LONDON — OCTOBER 29TH, 2004 — NVIDIA Corporation (Nasdaq: NVDA), a worldwide leader in graphics ...

IBM, one of the nation’s largest companies, sees a big future in 3D worlds — but it probably won’t be with Second Life. IBM has been eager to try out 3D marketing, for reasons we’ll get to. Like other ...

Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current ...

Yamaha was a developer of video display controllers or processors (VDP) in the late 1980s. The company made IBM-compatible CGA display controllers, including the YGY603. The company also made the ...