New X-HBM architecture delivers a 32K-bit wide data bus and potentially 512 Gbit per die density, offering 16X more bandwidth or 10X higher density than traditional HBM NEO Semiconductor unveils ...

Harini Muthukrishnan (U of Michigan); David Nellans, Daniel Lustig (NVIDIA); Jeffrey A. Fessler, Thomas Wenisch (U of Michigan). Abstract—”Despite continuing research into inter-GPU communication ...