Ansys ANSS is leveraging NVIDIA Corporation’s NVDA Omniverse application programming interfaces (APIs). This will “supercharge” the design of 3D integrated circuits (3D-ICs) through the integration of ...

Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...